KOSCO Industries
KOSCO Industries

Semiconductor Packaging
Test Service & Test Solutions



Teat services
  
KOSCO INDUSTRY has acquired a Taiwanese semiconductor back-end processing company with 100% self-financing and is providing competitive Wafer Probe Test Services. In addition to service offerings, the company has also completed the early establishment of production facilities for semiconductor back-end processing and testing equipment in the first half of 2025 and has officially commenced production.


Probe Test

- As per Customer's Device Specifications, Parameters, Vectors and Test Programs
- 6, 8 & 12" Wafers and Bumped Wagers
- Temperature Range : -55℃ to +150℃
- Class 1K Particle Environment

 
Final Test

- Wide range of IC packages such as PDIP, PLCC, SOIC, QFP, LQFP, TQFP, QFN, MLF, BGA, LGA, SIP, FLIP CHIP, POP, PLP and others
- Pick & Place and Turret Handlers availble
- Temperature Range :  55℃ to +150℃
- Class 10K Particle Environment

 
Backend

- Lead, Ball and Package Inspections
- Marking Inspections
- Bake Dry
- Tray and Tape & Reel Packings
- Shipments to Customer Sites or Customer's Customer Locations

 
Trunkey Service
 
Taiwan. USA. We provide smooth and efficient Trunkey Service in close cooperation with Fab Foundry and Package companies in Korea.


Test Solutions

Design-to-Test Solutions
We provide the latest solutions to reduce the cost of design-to-test, time-to-market, time-to-volume production and test for our customers.


Test Development

- Test Spec Verification
- Test Program Development
- Product Characterization
- Product / Test Correlation

 
Test Vector Conversion

We provide test vector conversion from test programs of ASCII, Verilog VCD, WGL, STIL and other test platforms to various test platforms owned by KOSCO INDUSTRIES.


Probe Card and Load Board Design

- Probe Card design and supply
- Load Board design and supply
- Test Socket Design and Supply
- Handler Change-Over-Kit design and supply


Test Data Management

We have established a Test Data Feedback System, and each customer's test data is kept for at least 3 years. In addition, Test Data is provided to customers through FTP, and customers can directly access the Data Server of KOSCO INDUSTRIES by logging on with the given Username and Password.


Test Status and Yield Monitor

The On-Line Monitoring System (OMS) is running 24 hours a day, 365 days a year, and customers can log on with the given username and password to monitor test status and test yield.


Logic, Mixed Signal & SOC

We have High Performance Testers to efficiently test Logic, Mixed Signal and SOC Devices such as MCU, Touch Controller, Timing Controller, ISP, DTV Chipset, Application Processor, Automotive and Mobile.


Analog & Mixed Signal 

We have High Performance Testers to efficiently test Analog and Mixed Signal Devices such as Audio, Video, PMIC, Automotive and Mobile.


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Glass Defects Detection Machine

Glass Defects Detection Machine is a fully automated detector that focuses on identifying defects in glass. This equipment combines a high-precision camera and special LED with our independently developed CCD software to detect scratches, smudges, corrosion, white and black dots, foreign matter, and concave or convex points. This significantly reduces the cost of traditional manual labor.
 
Features
  1. Untouched vision correction system, automatically adjusts.
  2. Real-time monitoring through a clear interface.
  3. Untouched transmission, avoiding double infection.
  4. Flexible for various product sizes.

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​​Light Guide Plate Detector Equipment

This system consists of a horizontal four-joint robot, an automatic cleaner, a film cover device, and CCD AI software. It is primarily used to detect surface defects on LGP, such as white dots, scratches, and smudges. The horizontal four-joint robot used in this equipment is able to move quickly and precisely, and it is also easy to manipulate. When combined with CCD detecting software, it is capable of significantly enhancing production efficiency.
Features a self-cleaning transmission belt to prevent cross-contamination.
Customizable AI vision algorithm that can be adjusted for different products.
Imitate the human observation angle to detect specific defects. Automatically sorting and stacking.
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Line scanning AOI device based on deep learning

The products from the assembly line are transported to the visual inspection station via the conveying mechanism. Subsequently, they are captured by the line scan camera at the station from various angles, including the front and the side. The AOI visual inspection system simulates the human eye to detect products, distinguishing between qualified and defective items, which are then sorted and discharged by the conveying mechanism. FeaturesHigh-sensitivity direct-drive turntable designed for flexible rotation.Customization AI vision algorithm can be tailored to different products.Automatically identify the location and information of the defective products.The vision software, composed of multiple line scan cameras, industrial lenses, special combination lights, and light controllers, can quickly switch between product specifications.

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Flip-chip Mounter

The reclaimer arm will transport the dies to the wafer expanding device, and the substrates reclaimer will transport the substrates to the conveyor belt, which will then send the substrates to the working area simultaneously. The conveyor belt will transport two substrates simultaneously under the guidance of machine vision. On the other hand, the ejector pin will lift the die, and the flip-action arm will pull the die and rotate it 180 degrees to allow the mounter arm to remove the die and transfer it to the scaling powder station. After dipping in flux, the mounting arm will place the DIE on the substrate precisely under the guidance of machine vision. When two substrates are fully loaded, they will be transported to the receiver in the same way as the wafer.
 
Application
Chip packaging (flip chip process)
 
Features
Untouched vision correction system, automatically adjusts.
Continuous material replacement.
Two-sided mounting arms, efficiently enhanced.
A double-track structure was adopted in the XY moving system.
Real-time monitoring through a clear interface.
High-precision, high-stability mechanical structures and transmission components




KOSCO Industries


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